Hy-Vee
Hy-vee Butterscotch Instant Pudding & Pie Filling
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Ingredients
SUGAR, MODIFIED CORN AND TAPIOCA STARCH, DEXTROSE, CONTAINS 2% OR LESS OF DISODIUM PHOSPHATE, TETRASODIUM PYROPHOSPHATE, NONFAT DRY MILK, ARTIFICIAL FLAVOR, MONO- AND DIGLYCERIDES (PREVENT FOAMING), P…
Contains milk. contains soy/soybean. may contain wheat. contains casein. contains dairy. may contain gluten. contains lactose